1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...
Decades of advances in the semiconductor industry continue to drive an insatiable consumer demand for smaller, more powerful, more ubiquitous semiconductor devices—whether in our cars, within our ...
Validate cross-chip data paths in multi-die packages and evaluate the impact on power, performance, and reliability.
Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory ...
Powering precision: why the future of high-power test benches must be fully integrated and automated
The global test and measurement (T&M) market is expanding from $34.11 billion in 2024 to an estimated $43.95 billion by 2030.
When I was managing software development, one of the messiest and least efficient areas was the system test region that was set up so programmers could unit test their applications. In the fray of ...
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